APPLICATIONS
Semiconductor, Display
ECO-Almag is a high-strength, highly formable aluminum-magnesium alloy that is gaining attention as a stainless steel alternative in the semiconductorand display industries.
Why is ECO-Almag suitable for the semiconductor and display industries?
ECO-Almag is a next-generation aluminum-magnesium alloy that combines high strength, ultra-precise formability, and excellent thermal conductivity. It is gaining attention in the semiconductor and display industries as a next-generation material that meets ESG standards by reducing carbon emissions and enhancing material recyclability.



ECO-Almag Semiconductor Wafer Ring Application Case



Property Items | ECO-Almag | SUS420J2 | Summary of Characteristics |
---|---|---|---|
Tape Adhesion Strength | same level | Standard | No issues at an equivalent level |
Surface Hardness (Hv) | 640 | 180 ~ 620 | ECO-Almag is generally harder |
Yield Strength (MPa) | 480 | 350 ~ 540 | Excellent mechanical strength even under high loads |
Surface Roughness (Ra µm) | 0.253 | 0.133 | SUS is smoother, but within acceptable process limits |
World’s First Successful Development of an Aluminum Wafer Ring
67% weight reduction and 20% cost savings compared to conventional stainless steel
Applicable to Back Grinding, Wafer Mounting, Dicing Saw, and Die Attach equipment
Excellent precision machinability, carbon emission reduction (ESG)
Applied to TVs, foldable phones, tablets, and automotive displays



Category | Thickness (mm) | Y.S. (MPa) | UTS (MPa) | El (%) | Remarks |
---|---|---|---|---|---|
SUS304 | 0.15 | 420 | 560 | 13 | Thickness ±2% |
ECO-Almag | 0.15 | 443 | 480 | 4.3 | - |
The only high-strength aluminum material producible below 0.3mm thickness
Can be applied at the same thickness with the same strength as the currently used SUS
5 times better heat dissipation, 67% lighter, and 50% cost reduction compared to existing materials
